RIE plasma etcher Etchlab 200
Cost-effectiveness
RIE plasma etcher Etchlab 200 combines parallel plate plasma source design with direct load.
Upgradeability
According to its modular design, the plasma etcher Etchlab 200 is upgradeable with larger pumping unit, vacuum load lock , and additional gas lines.
SENTECH control software
This plasma etcher is equipped with a user-friendly powerful software with mimic GUI, parameter window, recipe editor, data logging, user management.
The Etchlab 200 RIE plasma etcher represents a family of direct load plasma etcher combining the advantages of a parallel plate electrode design for RIE with the cost effective design of direct load. The Etchlab 200 features simple and fast sample loading from parts to
The Etchlab 200 plasma etcher can be configured for processing of materials that are compatible with wafer direct loading, including but not limited to silicon and silicon compounds, compound semiconductors, dielectrics, and metals.
The Etchlab 200 is operated by the advanced SENTECH control software using remote field bus technology and a very user-friendly general user interface.
- RIE plasma etcher
- Open lid
- For up to
200 mm wafers - Diagnostic windows for laser interferometer and OES
- Ellipsometer ports optionally available
- RIE plasma etcher
- Open lid
- For up to
300 mm wafers - Diagnostic windows for laser interferometer and OES